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BOW
ELECTRONIC SOLDER
TECHNICAL BULLETIN
BOW # 009
NO – CLEAN TACKY FLUX
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| The Bow 009 tacky flux is designed
to meet requirements for reliable solder joints in SMT
PC board assemblies. This tacky flux is specially designed
for today’s SMT applications. This formula was
designed to have a wider process window and better compatibility
with OSP than previous no-clean formulations. The Bow
009 can be used for rework, sphere attachment to BGA
packages and assembly operations such as Flip Chip attachment
to PWB substrates. |
Stencil Life:
8–10 hours
Tack Time: 6-8 hours
Appearance: Light straw in color
Viscosity: 525 kcps
Chlorine Content in Flux (%): Pass – IPC-TM-650
2.3.33, less than 2.5ug/in2 via Ion Chromatography.
Copper Mirror: MO as classified by IPC-TM-850
2.3.32.
Insulation Resistance: Greater than 1x1011
after humidity exposure. Tested according to IPC-TM-650
2.6.3.3. |
| Bow certifies that when stored properly
the material will meet all specifications for 12-18
months from the date of manufacture. Proper storage:
38-44°F, allow material
to warm up to ambient temperature before opening. (Do
not attempt to accelerate the warming process). |
| Bow 009 tacky flux residues
do not require cleaning. But if customer is required
to remove the residue it can be cleaned using a water
wash system with a saponifier. |
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Lead Free
Electronic
