| Stencil Life |
8-12 hours under proper
process parameters |
| Tack Time |
12-18 hours before or
after placing components |
| Solder
Alloys |
Sn63/Pb37;
Sn62/Pb36/Ag2; Sn96.5/Ag3.5; Sn10/Pb88/Ag2; Sn95/Sb5;
Sn43/Pb43/Bi14
(Other alloys available upon request) |
| Melting
Temperatures |
Sn63/Pb37:
183°C
Sn62/Pb36/Ag2: 179°C
Sn96.5/Ag3.5: 221°C;
Sn10/Pb88/Ag2: 268-290°C
Sn95/Sb5: 235-240°C
Sn43/Pb43/Bi14: 144-163°C
90Sn/10Pb: 183-220°C. |
| Appearance |
Homogenous dark gray
cream no separated flux present. |
| Flux
Content (wt %) |
Printing Applications
10.0-10.5% +/-1%
Dispensing Applications 13-14% +/-1%
Tested according to IPC-TM-650 2.2.20 |
| PH (5%
flux in DI) |
6.5-7.5 |
| Flux
Designation |
REMO |
| Viscosity |
Printing Applications
(Depending on alloy density), T2 and T2A 400 Kcps -
750Kcps +/-10%
T3 450 - 800Kcps +/-10% T4 475 - 850Kcps +/-10%;
Dispensing Applications, T2 and T2A 300 -400Kcps +/-10%
T3 325 - 425Kcps +/-10% T4 350 - 450Kcps +/-10%.
Tested according to IPC-TM-650 2.4.34 and 2.4.34.2 |
| Grain
Size |
-200/+325
(T2) 75-45 microns
-270/+400 (T2A) 53-38 microns
-325/+500
(T3) 45-25 microns
-400/+500 (T4) 38-25 microns
-500/+635
(T5) 25-20 microns.
Tested according to IPC-TM-650 2.2.14 and 2.2.14.2 |
| Particle
Sphericity |
99% of the powder spheres
exceed 80% roundness factor |
| Flux Designation/Copper
Mirror |
REMO as
classified by IPC-TM-650 2.3.32 |
| Reflow
Property |
The paste shall coalesce
into one button with no visible discoloration |
Lead Free
Electronic
